Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11551923 | Taiko wafer ring cut process method | Chien-Hsiung Huang, Cheng-Yen Lin | 2023-01-10 |
| 10026603 | Manufacturing process of wafer thinning | SHIH-CHING YANG, Chien-Hsiung Huang, Cheng-Yen Lin | 2018-07-17 |