Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10950762 | Round chip scale package and manufacturing method therefor | Jae-sik Min, Jae Yeop Lee, Byoung Gu Cho, Byoung Chul Cho | 2021-03-16 |
| 8261735 | Flameless portable heating kit | Byung-chul Jo, Byoung Gu Cho | 2012-09-11 |
| 8118021 | Pouch pack controlling temperature | Byoung Gu Cho | 2012-02-21 |