Issued Patents All Time
Showing 1–12 of 12 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7421353 | Digital integration method | — | 2008-09-02 |
| 7271028 | High density electronic interconnection | — | 2007-09-18 |
| 7132356 | Interconnection method | — | 2006-11-07 |
| 6613605 | Interconnection method entailing protuberances formed by melting metal over contact areas | — | 2003-09-02 |
| 6614110 | Module with bumps for connection and support | — | 2003-09-02 |
| 6388264 | Optocoupler package being hermetically sealed | — | 2002-05-14 |
| 6165820 | Package for electronic devices | — | 2000-12-26 |
| 5904499 | Package for power semiconductor chips | — | 1999-05-18 |
| 5866441 | Inverted chip bonded module with high packaging efficiency | — | 1999-02-02 |
| 5793105 | Inverted chip bonded with high packaging efficiency | — | 1998-08-11 |
| 5627406 | Inverted chip bonded module with high packaging efficiency | — | 1997-05-06 |
| 5378313 | Hybrid circuits and a method of manufacture | — | 1995-01-03 |