Issued Patents All Time
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8222138 | Method and structure of a thick metal layer using multiple deposition chambers | — | 2012-07-17 |
| 7927424 | Padded clamp ring with edge exclusion for deposition of thick AlCu/AlSiCu/Cu metal alloy layers | — | 2011-04-19 |
| 7675174 | Method and structure of a thick metal layer using multiple deposition chambers | — | 2010-03-09 |
| 6395629 | Interconnect method and structure for semiconductor devices | Stephen John Melosky | 2002-05-28 |
| 6365496 | Elimination of junction spiking using soft sputter etch and two step tin film during the contact barrier deposition process | — | 2002-04-02 |
| 6265312 | Method for depositing an integrated circuit tungsten film stack that includes a post-nucleation pump down step | Stephen John Melosky | 2001-07-24 |