Issued Patents All Time
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11614468 | Oscilloscope noise floor de-embedding for high speed toggle signal measurement | Liwei Zhao, Andrew Martwick, Michael Altmann, Michael Mirmak, Kamel Ahmad | 2023-03-28 |
| 8962391 | Method of fabricating a wafer level chip scale package without an encapsulated via | — | 2015-02-24 |
| 8610273 | Wafer level chip scale package without an encapsulated via | — | 2013-12-17 |
| 8508032 | Chip packaging | Martyn Robert Owen | 2013-08-13 |
| 8304875 | Semiconductor packages | — | 2012-11-06 |
| 7880282 | Semiconductor package with integrated heatsink and electromagnetic shield | — | 2011-02-01 |
| 5313515 | Call completion system with message writing indication upon registration of mobile with basestation | Michael J. Allen, John W. Garrett, Howard Green | 1994-05-17 |