JH

Janet Heyen

IM Intrinsiq Materials: 1 patents #2 of 16Top 15%
🗺 New York: #67,335 of 115,490 inventorsTop 60%
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Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
9999137 Method for forming vias on printed circuit boards David Ciufo 2018-06-12