Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 4845545 | Low profile semiconductor package | Howard Abramowitz, Jerry R. Carpenter | 1989-07-04 |
| 4641418 | Molding process for semiconductor devices and lead frame structure therefor | — | 1987-02-10 |
| 4642419 | Four-leaded dual in-line package module for semiconductor devices | — | 1987-02-10 |
| 4556896 | Lead frame structure | — | 1985-12-03 |