Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11658159 | Methods and apparatus for managing thermal behavior in multichip packages | Saravanan Sethuraman, Tonia G. Morris, Siaw Kang Lai, Yu Ying Ong | 2023-05-23 |
| 11164847 | Methods and apparatus for managing thermal behavior in multichip packages | Saravanan Sethuraman, Tonia G. Morris, Siaw Kang Lai, Yu Ying Ong | 2021-11-02 |