Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 7098080 | Method of making a semiconductor package with integrated heat spreader attached to a thermally conductive substrate core | — | 2006-08-29 | $13,270,000 |
| 7042084 | Semiconductor package with integrated heat spreader attached to a thermally conductive substrate core | — | 2006-05-09 | $14,660,000 |
| 6441480 | Microelectronic circuit package | Imran Yusuf, Johnny M. Cook, Jr. | 2002-08-27 | $48,184,000 |