Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7098080 | Method of making a semiconductor package with integrated heat spreader attached to a thermally conductive substrate core | — | 2006-08-29 |
| 7042084 | Semiconductor package with integrated heat spreader attached to a thermally conductive substrate core | — | 2006-05-09 |
| 6441480 | Microelectronic circuit package | Imran Yusuf, Johnny M. Cook, Jr. | 2002-08-27 |