Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10552173 | Methods and apparatus to configure parameters of a high-speed input-output interface | Jabeena Begum Gaibusab | 2020-02-04 |
| 9817054 | Electrical margining of multi-parameter high-speed interconnect links with multi-sample probing | Thanunathan Rangarajan, Arvind Kumar, Venkatraman Iyer | 2017-11-14 |