Issued Patents All Time
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8125087 | High-density flip-chip interconnect | — | 2012-02-28 |
| 6564452 | Method for creating printed circuit board substrates having solder mask-free edges | Joseph C. Barrett | 2003-05-20 |
| 6545351 | Underside heat slug for ball grid array packages | Joseph C. Barrett | 2003-04-08 |
| 6310298 | Printed circuit board substrate having solder mask-free edges | Joseph C. Barrett | 2001-10-30 |
| 6060777 | Underside heat slug for ball grid array packages | Joseph C. Barrett | 2000-05-09 |