Issued Patents All Time
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12322685 | Integrated circuit (IC) package with substrate having validation connectors | Luis Ricardo Perez-Corona, Ricardo Astro-Bohorquez, Francisco Javier Ramirez-Aldana | 2025-06-03 |