Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 9111929 | Package substrate dynamic pressure structure | Stewart M. Ongchin, Vadim Sherman, Stephen Tisdale, Xiaoqing Ma | 2015-08-18 | $11,320,000 |
| 8617921 | Package substrate dynamic pressure structure | Stewart M. Ongchin, Vadim Sherman, Stephen Tisdale, Xiaoqing Ma | 2013-12-31 | $14,080,000 |
| 8143721 | Package substrate dynamic pressure structure | Stewart M. Ongchin, Vadim Sherman, Stephen Tisdale, Xiaoqing Ma | 2012-03-27 | $20,416,000 |
| 7518222 | Apparatus and system for an IC substrate, socket, and assembly | Xiaoqing Ma, Stewart M. Ongchin, Stephen Tisdale, Vadim Sherman | 2009-04-14 | $13,316,000 |