Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 11486942 | Processor and chipset continuity testing of package interconnect for functional safety applications | Matthew W. Lee, Benedict C. Ofuonye, Erich N. Ewy | 2022-11-01 | $18,130,000 |
| 11022657 | Processor and chipset continuity testing of package interconnect for functional safety applications | Matthew W. Lee, Benedict C. Ofuonye, Erich N. Ewy | 2021-06-01 | $35,542,000 |