Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7592702 | Via heat sink material | Shawn Lloyd, Michael Kochanowski, John Oldendorf | 2009-09-22 |
| 7124931 | Via heat sink material | Shawn Lloyd, Michael Kochanowski, John Oldendorf | 2006-10-24 |
| 7104803 | Integrated circuit package socket and socket contact | Shawn Lloyd, John Oldendorf, Michael Kochanowski | 2006-09-12 |