Patents per Year
Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 7714427 | Integrated circuit die configuration for packaging | Chee Wai Wong | 2010-05-11 | $17,259,000 |
| 7341887 | Integrated circuit die configuration for packaging | Chee Wai Wong | 2008-03-11 | $19,082,000 |
| 7081800 | Package integrated one-quarter wavelength and three-quarter wavelength balun | Jianggi He, Udy Shrivastava | 2006-07-25 | $17,394,000 |