Issued Patents All Time
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9899362 | Mold chase for integrated circuit package assembly and associated techniques and configurations | — | 2018-02-20 |
| 9067342 | Mold chase for integrated circuit package assembly and associated techniques and configurations | — | 2015-06-30 |
| 8534574 | Underfill material dispenser | Curtis S. White, Sung Won Moon | 2013-09-17 |
| 8366982 | Differential pressure underfill process and equipment | — | 2013-02-05 |
| 8211501 | Fluorination pre-treatment of heat spreader attachment indium thermal interface material | — | 2012-07-03 |
| 7829195 | Fluorination pre-treatment of heat spreader attachment indium thermal interface material | — | 2010-11-09 |
| 6989972 | Magnetoresistive sensor with overlapping leads having distributed current | Kroum S. Stoev, Mathew Gibbons, Francis H. Liu, Aparna C. Vadde, Jing Zhang +2 more | 2006-01-24 |
| 6278595 | Magnetoresistive sensor having a hard-biasing material and a cubic-titanium-tungsten underlayer | Song S. Xue, James F. Dolejsi, Patrick J. Ryan | 2001-08-21 |
| 6185081 | Bias layers which are formed on underlayers promoting in-plane alignment of the c-axis of cobalt used in magnetoresistive transducers | Yingjian Chen, Mark S. Miller | 2001-02-06 |