Issued Patents All Time
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6534419 | Method and apparatus for reducing IC die mass and thickness while improving strength characteristics | — | 2003-03-18 |
| 6269723 | Method and apparatus for enhancement of a punch guide/receptor tool in a dambar removal system | — | 2001-08-07 |
| 5497681 | Method for making an IC lead-frame punch | — | 1996-03-12 |
| 5495780 | Method for sharpening an IC lead-frame punch | — | 1996-03-05 |
| 5452635 | Apparatus for integrated circuit lead-frame punching | — | 1995-09-26 |