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Home › Integrated Packaging Assembly › E. C. Ong
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E. C. Ong — 4 Patents

IAIntegrated Packaging Assembly: 1 patents #4 of 4Top 100%
Cupertino, CA: #2,992 of 6,989 inventorsTop 45%
California: #126,026 of 386,348 inventorsTop 35%
Overall (All Time): #1,080,739 of 4,157,543Top 30%
4 Patents All Time
E. C. Ong has been granted 4 US patents while listed as an inventor at Integrated Packaging Assembly. The first was granted in 1998 and the most recent in February 2002. E. C. Ong ranks #1,080,739 of 4,157,543 US inventors in our database (top 26.0%). Patent records list E. C. Ong in Cupertino, CA, US.

Patents per Year

Patents granted per year, 1998 to 2002Bar chart with a peak of 1 patents in 1998.peak 11998: 1 patents19981999: 1 patents19992001: 1 patents20012002: 1 patents2002

Issued Patents All Time

Showing 1–4 of 4 patents

Patent #TitleCo-InventorsDate
6347947 Method and apparatus for protecting and strengthening electrical contact interfaces — 2002-02-19
6296169 Flux-application fixture for a ball-grid-array (BGA) assembly process — 2001-10-02
5958466 Pressure-plate-operative system for one-side injection molding of substrate-mounted integrated circuits — 1999-09-28
5766535 Pressure-plate-operative system for one-side injection molding of substrate-mounted integrated circuits — 1998-06-16

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