EO

E. C. Ong

IA Integrated Packaging Assembly: 1 patents #4 of 4Top 100%
📍 Cupertino, CA: #2,973 of 6,989 inventorsTop 45%
🗺 California: #124,610 of 386,348 inventorsTop 35%
Overall (All Time): #1,271,444 of 4,157,543Top 35%
4
Patents All Time

Issued Patents All Time

Showing 1–4 of 4 patents

Patent #TitleCo-InventorsDate
6347947 Method and apparatus for protecting and strengthening electrical contact interfaces 2002-02-19
6296169 Flux-application fixture for a ball-grid-array (BGA) assembly process 2001-10-02
5958466 Pressure-plate-operative system for one-side injection molding of substrate-mounted integrated circuits 1999-09-28
5766535 Pressure-plate-operative system for one-side injection molding of substrate-mounted integrated circuits 1998-06-16