Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8329573 | Wafer level integration module having controlled resistivity interconnects | — | 2012-12-11 |
| 7998854 | Wafer level integration module with interconnects | — | 2011-08-16 |
| 7785928 | Integrated circuit device and method of manufacturing thereof | — | 2010-08-31 |
| 6759319 | Residue-free solder bumping process | Chee Chong Wong | 2004-07-06 |