MH

Ming-Fung Hsieh

IC Inpaq Technology Co.: 2 patents #17 of 93Top 20%
Overall (All Time): #2,020,778 of 4,157,543Top 50%
2
Patents All Time

Issued Patents All Time

Showing 1–2 of 2 patents

Patent #TitleCo-InventorsDate
8933343 Electronic structure and electronic package component for increasing the bonding strength between inside and outside electrodes Yu-Chia Chang, Chun-Pin Huang, Yung-Chang Peng 2015-01-13
8633793 Common mode filter Yu-Chia Chang, Chi-Wei Chen 2014-01-21