HK

Hung-Shung Ko

IC Inpaq Technology Co.: 1 patents #38 of 93Top 45%
📍 Keelung, TW: #359 of 650 inventorsTop 60%
Overall (All Time): #4,147,210 of 4,157,543Top 100%
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Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
10468378 Method for preparing a semiconductor package Yu-Ming Peng, Chu-Chun Hsu, Hsiu Lun Yeh 2019-11-05