HK

Hsiao-Lin Kuo

IC Inpaq Technology Co.: 1 patents #38 of 93Top 45%
Overall (All Time): #3,433,906 of 4,157,543Top 85%
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Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
7135415 Insulated structure of a chip array component and fabrication method of the same Ching-Chien Chen, Kwo-Fang Ku, Yu-Chin Hsu 2006-11-14