HK

HONG-SHENG KE

IC Inpaq Technology Co.: 2 patents #17 of 93Top 20%
Overall (All Time): #1,890,546 of 4,157,543Top 50%
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Showing 1–2 of 2 patents

Patent #TitleCo-InventorsDate
11152320 Semiconductor package structure and method of the same Yu-Ming Peng, Wei-Lun Hsu, Chu-Chun Hsu, Yu-Chia Chang 2021-10-19
8846453 Semiconductor package structure and method of manufacturing the same Chu-Chun Hsu, Wei-Luen Hsu, Yao Ming Yang, Yu-Chia Chang 2014-09-30