Issued Patents All Time
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10613281 | Method and system for coupling a light source assembly to an optical integrated circuit | Attila Mekis, Peng SUN, Steffen Gloeckner, Michael Mack | 2020-04-07 |
| 10345540 | Method and system for coupling a light source assembly to an optical integrated circuit | Attila Mekis, Peng SUN, Steffen Gloeckner, Michael Mack | 2019-07-09 |
| 7972683 | Wafer bonding material with embedded conductive particles | Christopher S. Gudeman, Ian R. Johnston | 2011-07-05 |
| 7968986 | Lid structure for microdevice and method of manufacture | Hung D. Nguyen | 2011-06-28 |
| 7675162 | Interconnect structure using through wafer vias and method of fabrication | John S. Foster, Paul J. Rubel, Kimon Rybnicek | 2010-03-09 |
| 7229838 | MEMS actuator and method of manufacture for MEMS particle sorting device | John S. Foster, John C. Harley, Richard Martin, Hung D. Nguyen, Paul J. Rubel | 2007-06-12 |
| 7220594 | Method and apparatus for sorting particles with a MEMS device | John S. Foster, John C. Harley, Richard Martin, Hung D. Nguyen, Paul J. Rubel | 2007-05-22 |
| 7059201 | Use of multi-layer thin films as stress sensors | Shiva Prakash, Srinivasan K. Ganapathi, Randolph S. Gluck | 2006-06-13 |
| 6829950 | Method and apparatus for pressure sensing | Srinavasan K. Ganapathi, Randolph S. Gluck, Shiva Prakash | 2004-12-14 |
| 6578436 | Method and apparatus for pressure sensing | Srinavasan K. Ganapathi, Randolph S. Gluck, Shiva Prakash | 2003-06-17 |