Issued Patents All Time
Showing 1–11 of 11 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10017381 | Microfabricated pressure transducer | — | 2018-07-10 |
| 9533877 | Anodic bonding of dielectric substrates | — | 2017-01-03 |
| 9388037 | Device using glass substrate anodic bonding | Jeffery F. Summers | 2016-07-12 |
| 9330874 | Solder bump sealing method and device | Vikram Patil | 2016-05-03 |
| 9315375 | Method using glass substrate anodic bonding | Jeffery F. Summers | 2016-04-19 |
| 9274180 | Microfabricated magnetic field transducer with flux guide | — | 2016-03-01 |
| 9156679 | Method and device using silicon substrate to glass substrate anodic bonding | Jeffery F. Summers | 2015-10-13 |
| 8646111 | Coupled mass-spring systems and imaging methods for scanning probe microscopy | Kimberly L. Turner | 2014-02-04 |
| 8022535 | Systems, devices, and methods for semiconductor device temperature management | Bradley J. Winter | 2011-09-20 |
| 7979916 | Preamplifying cantilever and applications thereof | Bede Pittenger, Kumar R. Virwani | 2011-07-12 |
| 7781263 | Systems, devices, and methods for semiconductor device temperature management | Bradley J. Winter | 2010-08-24 |