Issued Patents All Time
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8736081 | Wafer level hermetic bond using metal alloy with keeper layer | John S. Foster, Christopher S. Gudeman, Jaquelin K. Spong, Douglas L. Thompson | 2014-05-27 |
| 8288211 | Wafer level hermetic bond using metal alloy with keeper layer | John S. Foster, Douglas L. Thompson | 2012-10-16 |
| 7960208 | Wafer level hermetic bond using metal alloy with raised feature | Gregory A. Carlson, David M. Erlach, Jeffery F. Summers | 2011-06-14 |
| 7872432 | MEMS thermal device with slideably engaged tether and method of manufacture | Jeffery F. Summers | 2011-01-18 |
| 7864006 | MEMS plate switch and method of manufacture | John S. Foster, Paulo Silveira da Motta, Kimon Rybnicek | 2011-01-04 |
| 7687304 | Current-driven device using NiMn alloy and method of manufacture | Gregory A. Carlson, Jeffery F. Summers, Douglas L. Thompson | 2010-03-30 |
| 7688167 | Contact electrode for microdevices and etch method of manufacture | Douglas L. Thompson | 2010-03-30 |
| 7569926 | Wafer level hermetic bond using metal alloy with raised feature | Gregory A. Carlson, David M. Erlach, Jeffery F. Summers | 2009-08-04 |