Issued Patents All Time
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12424454 | Composite layer circuit element | Chuan-Ming Yeh, Heng-Shen Yeh, Cheng-Chi Wang | 2025-09-23 |
| 12322686 | Redistribution layer structure | Hung-Sheng Chou, Wen-Hsiang Liao, Heng-Shen Yeh, Cheng-Chi Wang | 2025-06-03 |
| 12315741 | Method of manufacturing electronic device with reduced substrate warpage | Chuan-Ming Yeh, Heng-Shen Yeh, Sheng-Hui Chiu | 2025-05-27 |
| 12197056 | Electronic device and manufacturing method thereof | Sheng-Hui Chiu | 2025-01-14 |
| 12148685 | Redistribution layer structure | Hung-Sheng Chou, Wen-Hsiang Liao, Heng-Shen Yeh, Cheng-Chi Wang | 2024-11-19 |
| 12107036 | Redistribution layer structure and manufacturing method thereof | Cheng-Chi Wang, Heng-Shen Yeh, Chuan-Ming Yeh | 2024-10-01 |
| 11764077 | Composite layer circuit element and manufacturing method thereof | Chuan-Ming Yeh, Heng-Shen Yeh, Cheng-Chi Wang | 2023-09-19 |
| 10906288 | Method for manufacturing display device | Wen-Chien Lin | 2021-02-02 |
| 9983438 | Display device | Li-Wei Mao | 2018-05-29 |