Issued Patents All Time
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12230558 | Package device | Chia-Chieh Fan, Kuan-Jen Wang, Cheng-Chi Wang, Yi-Hung Lin, Li-Wei Sung | 2025-02-18 |
| 11758666 | Manufacturing method of metal structure | Yi-Hung Lin | 2023-09-12 |
| 11672081 | Manufacturing method of metal structure | Yi-Hung Lin | 2023-06-06 |
| 11488899 | Package device | Chia-Chieh Fan, Kuan-Jen Wang, Cheng-Chi Wang, Yi-Hung Lin, Li-Wei Sung | 2022-11-01 |
| 11075155 | Package structure and manufacturing method thereof | Chia-Chieh Fan, Cheng-Chi Wang, Kuan-Jen Wang | 2021-07-27 |
| 10490493 | Package structure and manufacturing method thereof | Chia-Chieh Fan, Cheng-Chi Wang, Kuan-Jen Wang | 2019-11-26 |