Issued Patents All Time
Showing 26–28 of 28 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6715203 | Substrate for power semiconductor modules with through-plating of solder and method for its production | Manfred Loddenkoetter | 2004-04-06 |
| 6483128 | Connecting device for power semiconductor modules with compensation for mechanical stresses | Manfred Loddenkotter | 2002-11-19 |
| 6431259 | Spring clip for fixing semiconductor modules to a heat sink | Horst Hellbrück, Ralf Jörke, Konstantin Kanelis, Manfred Loddenkotter | 2002-08-13 |