KH

Klaus Herlitz

Infineon Technologies Ag: 1 patents #4,439 of 7,486Top 60%
📍 Dresden, DE: #1,650 of 3,254 inventorsTop 55%
Overall (All Time): #3,541,033 of 4,157,543Top 90%
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Issued Patents All Time

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
6371833 Backing film for chemical mechanical planarization (CMP) of a semiconductor wafer Kai Huckels 2002-04-16