Issued Patents All Time
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8466061 | Method for forming a through via in a semiconductor element and semiconductor element comprising the same | Stefan Kolb, Bernhard Winkler, Ivo Rangelow, Hans-Olof Blom | 2013-06-18 |