JH

Joachim Hopfner

Infineon Technologies Ag: 2 patents #3,160 of 7,486Top 45%
📍 Planegg, DE: #49 of 130 inventorsTop 40%
Overall (All Time): #2,199,755 of 4,157,543Top 55%
2
Patents All Time

Issued Patents All Time

Showing 1–2 of 2 patents

Patent #TitleCo-InventorsDate
6531378 Method for processing wafer by applying layer to protect the backside during a tempering step and removing contaminated portions of the layer — 2003-03-11
6316275 Method for fabricating a semiconductor component — 2001-11-13