Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12205842 | Wafer chuck for a laser beam wafer dicing equipment | Johannes Mueller, Christoph Ahamer, Gerald Lackner, Walter Leitgeb | 2025-01-21 |
| 12170226 | Method for separating dies from a semiconductor substrate | Benjamin Bernard, Mario Stefenelli | 2024-12-17 |
| 6847268 | Wide-band circuit for splitting or joining radio-frequency powers | Thomas Haunberger, Manuel Lund | 2005-01-25 |