Issued Patents All Time
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8263438 | Method for connecting a die assembly to a substrate in an integrated circuit | Alvin Seah | 2012-09-11 |
| 7880277 | Method for connecting a die assembly to a substrate in an integrated circuit and a semiconductor device comprising a die assembly | Alvin Seah | 2011-02-01 |
| 7659620 | Integrated circuit package employing a flexible substrate | — | 2010-02-09 |
| 7224058 | Integrated circuit package employing a heat-spreader member | — | 2007-05-29 |
| 6278613 | Copper pads for heat spreader attach | Chow Seng Guan | 2001-08-21 |