Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11812663 | Method for manufacturing flexible thermoelectric structure | Ren-Der Jean, Hong-Ching Lin, Hsu-Shen Chu | 2023-11-07 |
| 10964476 | Capacitor with multiple dielectric layers having dielectric powder and polyimide | Chun-An Lu, Yuan-Ling Tsai | 2021-03-30 |
| 9905327 | Metal conducting structure and wiring structure | Yuan-Ling Tsai, Jiun-Jang Yu | 2018-02-27 |