Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11764166 | Semiconductor package structure | Hsin-Cheng Lai, Chieh-Wei Feng, Tai-Jui Wang, Yu-Hua Chung, Tzu-Yang Ting | 2023-09-19 |
| 11251115 | Redistribution structure and forming method thereof | Shao-An Yan, Chieh-Wei Feng, Tzu-Yang Ting, Tzu-Hao Yu, Chien-Hsun Chu +1 more | 2022-02-15 |
| 10644167 | Thin film transistor and manufacturing method thereof | Tai-Jui Wang, Yung-Hui Yeh, Hsiao-Chiang Yao, Chun-Hung Chu | 2020-05-05 |