Issued Patents All Time
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10129974 | Multi-layer circuit structure | Chien-Min Hsu, Min-Lin Lee, Hung-I Liu, Ching-Shan Chang | 2018-11-13 |
| 8525328 | Power device package structure | Jiin-Shing Perng, Min-Lin Lee, Shinn-Juh Lai | 2013-09-03 |
| 8237520 | Capacitor devices with a filter structure | Min-Lin Lee, Jiin-Shing Perng, Sheng-Che Hung, Shinn-Juh Lai | 2012-08-07 |
| 8198538 | Capacitor devices having multi-sectional conductors | Chien-Min Hsu, Min-Lin Lee, Shinn-Juh Lai, Ray Hong | 2012-06-12 |
| 7875808 | Embedded capacitor device having a common coupling area | Min-Lin Lee, Shinn-Juh Lay, Chin-Sun Shyu | 2011-01-25 |
| 7064427 | Buried array capacitor and microelectronic structure incorporating the same | Stephen Cheung Kam Chung, Jungle Lee, Shinn-Juh Lay, Randy Wu, Yu-Mei Cheng | 2006-06-20 |
| 6717071 | Coaxial via hole and process of fabricating the same | Min-Lin Lee, Ted Ho | 2004-04-06 |
| 6683781 | Packaging structure with low switching noises | Ted Ho, Min-Lin Lee, Shinn-Juh Lay | 2004-01-27 |