Issued Patents All Time
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10695977 | Apparatus and method for adjusting and controlling the stacking-up layer manufacturing | Wei-Chin Huang | 2020-06-30 |
| 10675655 | Device and method for powder distribution and additive manufacturing method using the same | Ching-Chih Lin, Steven Lin, Wei-Lun Tai, Wen-Peng Tseng, Ji-Bin Horng | 2020-06-09 |
| 9884455 | Apparatus and method for adjusting and controlling the stacking-up layer manufacturing | Wei-Chin Huang | 2018-02-06 |
| 9533350 | Device and method for powder distribution and additive manufacturing method using the same | Ching-Chih Lin, Steven Lin, Wei-Lun Tai, Wen-Peng Tseng, Ji-Bin Horng | 2017-01-03 |
| 8889224 | Method of forming parylene film | Chun-Hao Chang | 2014-11-18 |
| 7973646 | Method and apparatus for inspecting radio frequency identification tags | Hui-Ta Chen, Guo-Shing Huang, Ching-Chih Lin, Chun-Hao Chang, Ming-Hsien Ko +1 more | 2011-07-05 |
| 7371661 | Wafer bonding method | Chun-Hao Chang, Shih-Chieh Liao, Guo-Shing Huang, Wei-Yu Chen | 2008-05-13 |