Issued Patents All Time
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8508022 | Ultra thin package for electric acoustic sensor chip of micro electro mechanical system | Tzong-Che Ho, Jason Pan, Pin Chang, Jung-Tai Chen, Hsin-Li Lee +1 more | 2013-08-13 |
| 8218797 | Micro-speaker and manufacturing method thereof | Hsin-Li Lee, Cheng-Hsin Chuang, Jin-Yao Lai | 2012-07-10 |
| 7989948 | Chip package structure and method of fabricating the same | Jui-Ching Hsieh, Pin Chang, Chung-De Chen, Li-Chi Pan, Yu-Jen Wang | 2011-08-02 |
| 7960805 | MEMS structure with suspended microstructure that includes dielectric layer sandwiched by plural metal layers and the dielectric layer having an edge surrounded by peripheral metal wall | Jen-Yi Chen | 2011-06-14 |
| 7618120 | Inkjet printhead and process for producing the same | Yu-Jen Fang | 2009-11-17 |
| 7284829 | Inkjet printhead and process for producing the same | Yu-Jen Fang | 2007-10-23 |
| 7208065 | Structure for measuring the etching speed | Jing-Hung Chiou, Kai-Hsiang Yen, Chao Liang, Stella Y. H. Chen | 2007-04-24 |
| 6828164 | Method for measuring the etching speed | Jing-Hung Chiou, Kai-Hsiang Yen, Chao Liang, Stella Y. H. Chen | 2004-12-07 |