Issued Patents All Time
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5421853 | High performance binder/molder compounds for making precision metal part by powder injection molding | Wen-Hsin Chen, Minh-Jhy Jiang, Kuo-Yao Weng, Ming-Shyong Lai, Jiann-Tsair Jeng | 1995-06-06 |