CM

Chao-Chuang Mai

IT ITRI: 12 patents #377 of 9,619Top 4%
MO Mostek: 2 patents #16 of 83Top 20%
DS Dallas Semiconductor: 1 patents #78 of 116Top 70%
📍 Zhuolan Township, TX: #1 of 3 inventorsTop 35%
Overall (All Time): #311,536 of 4,157,543Top 8%
15
Patents All Time

Issued Patents All Time

Showing 1–15 of 15 patents

Patent #TitleCo-InventorsDate
11927940 Management method for cutting tool of machine tool Chin-Hui Chen, Chi-Hsiang Lin, Zi Lin 2024-03-12
11650573 Management method for cutting tool of machine tool Chin-Hui Chen, Chi-Hsiang Lin, Zi Lin 2023-05-16
11407112 Method and system for predicting collision of machining path Shu-Yu Lin, Ming-Chun Ho, Chu-Kai Huang 2022-08-09
11378493 Method for motion test and control host of movable machinery Ming-Chun Ho, Chin-Hui Chen, Hsin-Chang Chang 2022-07-05
10509391 Machine tool collision avoidance method and system using the same Chin-Hui Chen, Shu-Yu Lin 2019-12-17
10209702 Tool management system and method thereof Chih-Ping Cheng 2019-02-19
9421626 Apparatus and method for electrical discharge machining modulation control Chin-Hui Chen, Chih-Ping Cheng, Der-Shuen Chen, Ming-Ji Chen 2016-08-23
9205525 System and method for offsetting measurement of machine tool Chih-Ping Cheng, Chang-Sheng Chen, Chin-Hui Chen, Chia-Sheng Chiang 2015-12-08
9205504 Self-adjusting power device for high efficiency electrical discharge machining and method thereof Der-Shuen Chen, Chen-Huei Kuo, Chih-Ping Cheng, Chin-Hui Chen 2015-12-08
7871503 Electrochemical discharge machining device Chin-Hui Chen, Ming-Ji Chen, Der-Shuen Chen 2011-01-18
7576295 Method for detecting and compensating electrode wear of electric discharge machining Ming-Ji Chen, Jui-Kuan Lin, Chin-Hui Chen 2009-08-18
6847002 Microelectrode machining device CHING-CHENG YANG, Jui-Kuan Lin, Hsin-Chuan Su 2005-01-25
6145035 Card cradle system and method Francis A. Scherpenberg, Titkuan Hui, Wayne Mendenhall 2000-11-07
4553314 Method for making a semiconductor device Tsiu C. Chan, Myint Hswe 1985-11-19
4445266 MOSFET Fabrication process for reducing overlap capacitance and lowering interconnect impedance William M. Whitney, William M. Gosney, Donald J. Gulyas 1984-05-01