| 7881072 |
System and method for processor power delivery and thermal management |
Joseph T. DiBene, II, David Hartke, Edward Derian |
2011-02-01 |
| 7245507 |
Method and apparatus for providing power to a microprocessor with integrated thermal and EMI management |
Joseph T. DiBene, II, David Hartke, James J. Hjerpe Kaskade |
2007-07-17 |
| 6847529 |
Ultra-low impedance power interconnection system for electronic packages |
Joseph T. DiBene, II, David Hartke, Edward Derian |
2005-01-25 |
| 6618268 |
Apparatus for delivering power to high performance electronic assemblies |
Joseph T. DiBene, II, David Hartke, Edward Derian, James M. Broder, Jose San Andres +1 more |
2003-09-09 |
| 6556455 |
Ultra-low impedance power interconnection system for electronic packages |
Joseph T. DiBene, II, David Hartke, Edward Derian |
2003-04-29 |
| 6452113 |
Apparatus for providing power to a microprocessor with integrated thermal and EMI management |
Joseph T. DiBene, II, David Hartke, James H. Kaskade |
2002-09-17 |
| 5213715 |
Directionally conductive polymer |
Timothy P. Patterson |
1993-05-25 |
| 5147210 |
Polymer film interconnect |
Timothy P. Patterson |
1992-09-15 |
| 5069626 |
Plated plastic castellated interconnect for electrical components |
Timothy P. Patterson, Joseph Baia |
1991-12-03 |
| 4843188 |
Integrated circuit chip mounting and packaging assembly |
Timothy P. Patterson |
1989-06-27 |
| 4487638 |
Semiconductor die-attach technique and composition therefor |
— |
1984-12-11 |
| 4388132 |
Method of attaching a protective film to an integrated circuit |
Gregory K. Lin |
1983-06-14 |