Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12144124 | Low-roughness surface-treated copper foil with low bending deformation, copper clad laminate comprising same, and printed wiring board | Chang Yol Yang, Jung-Woo Seo, Sunhyoung Lee | 2024-11-12 |
| 11622445 | Surface-treated copper foil, manufacturing method thereof, copper foil laminate including the same, and printed wiring board including the same | Sang Hwa Yoon, Chang Yol Yang, Jung-Woo Seo, Young Ho Ryu, Eun Sil Choi +2 more | 2023-04-04 |