RC

Richard Lee Carlson

IBM: 2 patents #32,839 of 70,183Top 50%
📍 Quincy, CA: #56 of 119 inventorsTop 50%
🗺 California: #185,134 of 386,348 inventorsTop 50%
Overall (All Time): #2,217,862 of 4,157,543Top 55%
2
Patents All Time

Issued Patents All Time

Showing 1–2 of 2 patents

Patent #TitleCo-InventorsDate
6446335 Direct thermal compression bonding through a multiconductor base layer Bruce Dale King, Rudolph Manuel Lopez, Alex Irwin Panasiuk, George G. Zamora 2002-09-10
6093894 Multiconductor bonded connection assembly with direct thermal compression bonding through a base layer Bruce Dale King, Rudolph Manuel Lopez, Alex Irwin Panasiuk, George G. Zamora 2000-07-25