Issued Patents All Time
Showing 301–312 of 312 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7298617 | Cooling apparatus and method employing discrete cold plates disposed between a module enclosure and electronics components to be cooled | Levi A. Campbell, Richard C. Chu, Michael J. Ellsworth, Jr., Roger R. Schmidt, Robert E. Simons | 2007-11-20 |
| 7298618 | Cooling apparatuses and methods employing discrete cold plates compliantly coupled between a common manifold and electronics components of an assembly to be cooled | Levi A. Campbell, Richard C. Chu, Michael J. Ellsworth, Jr., Roger R. Schmidt, Robert E. Simons | 2007-11-20 |
| 7286351 | Apparatus and method for facilitating cooling of an electronics rack employing a closed loop heat exchange system | Levi A. Campbell, Richard C. Chu, Michael J. Ellsworth, Jr., Roger R. Schmidt, Robert E. Simons | 2007-10-23 |
| 7283358 | Apparatus and method for facilitating cooling of an electronics rack by mixing cooler air flow with re-circulating air flow in a re-circulation region | Levi A. Campbell, Ricahrd C. Chu, Michael J. Ellsworth, Jr., Roger R. Schmidt, Robert E. Simons | 2007-10-16 |
| 7277283 | Cooling apparatus, cooled electronic module and methods of fabrication thereof employing an integrated coolant inlet and outlet manifold | Levi A. Campbell, Richard C. Chu, Michael J. Ellsworth, Jr., Roger R. Schmidt, Robert E. Simons | 2007-10-02 |
| 7274566 | Cooling apparatus for an electronics subsystem employing a coolant flow drive apparatus between coolant flow paths | Levi A. Campbell, Richard C. Chu, Michael J. Ellsworth, Jr., Roger R. Schmidt, Robert E. Simons | 2007-09-25 |
| 7272005 | Multi-element heat exchange assemblies and methods of fabrication for a cooling system | Levi A. Campbell, Richard C. Chu, Michael J. Ellsworth, Jr., Roger R. Schmidt, Robert E. Simons | 2007-09-18 |
| 7233494 | Cooling apparatus, cooled electronic module and methods of fabrication thereof employing an integrated manifold and a plurality of thermally conductive fins | Levi A. Campbell, Richard C. Chu, Michael J. Ellsworth, Jr., Roger R. Schmidt, Robert E. Simons | 2007-06-19 |
| 7206203 | Electronic device cooling assembly and method employing elastic support material holding a plurality of thermally conductive pins | Levi A. Campbell, Richard C. Chu, Michael J. Ellsworth, Jr., Robert E. Simons, Roger R. Schmidt | 2007-04-17 |
| 7184269 | Cooling apparatus and method for an electronics module employing an integrated heat exchange assembly | Levi A. Campbell, Richard C. Chu, Michael J. Ellsworth, Jr., Roger R. Schmidt, Robert E. Simons | 2007-02-27 |
| 7086247 | Cooling system and method employing auxiliary thermal capacitor unit for facilitating continuous operation of an electronics rack | Levi A. Campbell, Richard C. Chu, Michael J. Ellsworth, Jr., Roger R. Schmidt, Robert E. Simons | 2006-08-08 |
| 6973801 | Cooling system and method employing a closed loop coolant path and micro-scaled cooling structure within an electronics subsystem of an electronics rack | Levi A. Campbell, Richard C. Chu, Michael J. Ellsworth, Jr., Roger R. Schmidt, Robert E. Simons | 2005-12-13 |