KO

Keiichi Ohtsubo

IBM: 1 patents #44,794 of 70,183Top 65%
📍 Moriyama, JP: #1,620 of 2,577 inventorsTop 65%
Overall (All Time): #3,555,604 of 4,157,543Top 90%
1
Patents All Time

Issued Patents All Time

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
6441312 Electronic package with plurality of solder-applied areas providing heat transfer Hirotoshi Tanimura, Shinji Ueno 2002-08-27