Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6731004 | Electronic device and method of producing same | — | 2004-05-04 |
| 6229220 | Bump structure, bump forming method and package connecting body | Reijiro Shoji | 2001-05-08 |
| 6093964 | Connection structure utilizing a metal bump and metal bump manufacturing method | — | 2000-07-25 |