Issued Patents All Time
Showing 26–26 of 26 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9299686 | Implementing integrated circuit chip attach in three dimensional stack using vapor deposited solder Cu pillars | Phillip V. Mann, Kevin M. O'Connell, Arvind K. Sinha | 2016-03-29 |