Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9739942 | Method for manufacturing optical circuit board | — | 2017-08-22 |
| 6562662 | Electronic package with bonded structure and method of making | Toshihiro Matsumoto | 2003-05-13 |
| 6294831 | Electronic package with bonded structure and method of making | Toshihiro Matsumoto | 2001-09-25 |
| 6265085 | Bonding material and bump | Tomofumi Watanabe | 2001-07-24 |